MICROSTRUCTURE EVOLUTION DURING PERITECTIC L + Al6Mn(Fe) → α-Al + α-AlMnFeSi PROCESS IN AlFeMnSi ALLOYS

In this work, the course of peritectic L + Al6Mn(Fe) → α-Al + α-AlMnFeSi transformation taking place in AlFeMnSi alloys was traced. The specific microstructural effects in the transformed primary p...

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EFFECT OF SURFACE COATING AND FLUX TYPE ON THE SOLDERABILITY OF PCB BY LEAD-FREE SAC305 ALLOY

This paper presents the results of tests on the effect of the surface coating and flux type on the solderability of PCB by lead-free tin-based SAC305 (SnAg3.0Cu0.5) alloy determining the size of the contact angle by a wetting balance method. The s...

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SIMULATION RESEARCH OF THE FLOW OF THE MEDIA THROUGH A BALL REFLUX VALVE AT VARIOUS DENSITIES OF THE FLOATING BALL WITH THE USE OF FLOW-3D SOFTWARE

Modernisation works aiming at lowering the weight andincreasing performance of the range of ball reflux valves include also, among other things, lowering the weight (density) of floating balls being an important element of this type of valve...

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Effect of oxidation and mechanical damage of PCBs with OSP finish on their solderability with SAC305 alloy

The paper focuses on the experimental investigation of wetting behavior and solderability of commercial lead-free solder on Printed Circuit Board (PCB) covered with an OSP finish (Organic Surface Protectant) characterized by physical (mechanically...

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Perspectives and directions of the development of new generation lead-free soldering alloys and their application possibilities in the consumer electronics lead-free soldering technology

The new technological challenges and the high economical and commercial potential connected with the development of new generation soldering alloys used in the consumer electronics lead-free soldering technology is a subject which is gaining incre...

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